It also shows what important players have offered to the market and their technologies behind the prototypes/products. This report provides all the major technology choices with detailed introduction, analysis, and comparison. Commercial mass transfer and bonding tools are available on the market today. Therefore, an increasing number of people put more effort also on technologies such as inspection, repair, driving, image improvement, light management, as well as ramping yield and productivity. Recently, more and more players are realizing a complete understanding of all the processes is key. For instance, several years ago, the major efforts were concentrated in die miniaturization, chip design and mass transfer, etc.
After years of development, some technology difficulties have been solved, while new challenges are placed in front of us. To fabricate a µLED display, many technologies and processes are involved, such as epitaxy, photolithography, chip fabrication, substrate removal, inspection, mass transfer, bonding and interconnection, testing, repair, backplane and drive IC, etc.